The manufacturer assumes the use of a revolutionary technique based on ultraviolet extreme lithography (EUV).
Currently the leader in semiconductor manufacturing, Samsung today announced the completion of the development process of the new processors 7LPP (Low Power Plus). They are 7-nanometer chips, which the manufacturer has been marinating in recent months using extreme ultraviolet (EUV) lithography techniques. This evolution of the technology opens doors to the planning in the future of the 3 nm chips, the company said in a statement.
The chips of 7 nm, whose "wafers" start to be manufactured today, will occupy about 40% of surface, compared to the previous generation. In practice, the new chips will allow for a 40% increase in efficiency, with 20% higher performance or up to 50% energy savings when compared to 10nm technology.
The technology is the company's commitment to provide device manufacturers with a chip ready to handle the future 5G, artificial intelligence, IoT, datacenter, networking and automotive industry.
By 2020, Samsung hopes to increase the production capacity of the new chips to meet the market's needs for next-generation processor input. Its technology also includes inspection tools, which allow you to detect and eliminate defective components in the initial manufacturing phase.